Applied QED Solutions - Glossary of Terms (GoT)

Glossary of Terms (GoT)

This GoT is provided to assist our clients and customers with their understanding of the industry matters that Applied QED Solutions services. Incorporated into this GoT are terms, nomenclature, phrases, and acronyms that may be useful to the reader.

As one might expect, several terms have multiple and differing definitions. It is well recognized that this can lead to some level of confusion. The reader is advised to use appropriate judgement in selecting which definition goes with each term based on the context of usage.

Please alert us to any omissions, additions, errors, or other augmentations you might deem worthy of this listing by using this feedback form. As always Applied QED Solutions will work effectively to keep this list up-to-date.

QED - Quod Erat Demonstrandum
          Quite Easily Done
          Quality Engineering Design
          Quick Evaluation Demonstration

A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | Symbols

- A -

a - absorptivity
aka - also known as
A - Area
A - Amperes
AC - Alternating Current
AGW - American Wire Gage
Alt - Altitude
Amb - Ambient
AMR - Absolute Maximum Ratings (provided as the limit for the "reliable" use of components)
ANSI - American National Standards Institute
AOQ - Average Outgoing Quality
API - Application Product Interface
APL - Approved Parts List
AQAUD - Axial Quad
AS - Aerospace Standard
ASCII - American Standard Code for Information Interchange
ASIC - Application-Specific Integrated Circuits
ASL - Approved Supplier List
ASSP - Application-Specific Standard Parts
ASTM - American Society for Testing and Materials
ATR - Air Transport Rack

- B -

bnd - bond
B - Beta = the inverse of the absolute boundary layer fluid temperature
BB - Bottom Brazed
BC - Boundry Condition
BGA - Ball Grid Array
Bluetooth - a protocol for connecting digital devices via short-range radio links
BoE - Basis of Estimate
BOM - Bill Of Materials
BOTE - Back Of The Envelope

- C -

c-a - case to ambient
c-b - case to board
c-l - case to lead
c-s - case to sink
cm - Centimeter
C - Celsius
C - Ceramic package material
CAGE - Commercial and Government Entity
CoC - Certificate of Compliance
CoPN - Company Part Number
Cp - Specific Heat at constant pressure
Cpk - Process Capability Index
Ct - Specific Heat at constant temperature
Cv - Specific Heat at constant volume
CAD - Computer Aided Design
CAE - Computer Aided Engineering
CAGE - Commercial and Government Entity
CALCE - Center for Advanced Life Cycle Engineering
CALCE - Computer Aided Life Cycle Engineering (www.calce.umd.edu)
CAM - Computer Aided Manufacturing
CCA - Circuit Card Assembly
CCGA - Ceramic Column Grid Array
CDIP - Ceramic DIP
CDR - Critical Design Review
CEMA - Consumer Electronics Manufacturers Association
CFD - Computational Fluid Dynamics
CFP - Ceramic Flat Pack
CGA - Column Grid Array
CGS - Centimeter Gram Second
CI-CGA - Column Interposer - Ceramic Grid Array
CID - Commercial Item Description
CSP - Chip Scale Package
CJCC - Ceramic J Leaded Chip Carrier
CLCC - Ceramic Leaded Chip Carrier
CLLCC - Ceramic Lead Less (no lead) Chip Carrier
CLTM - Component Level Thermal Management
CM - Contract Manufacturing
COB - Chip On Board
COC - Chip On Chip
COL - Chip On Lead
COF - plastic Chip On Foil package
COTS - Commercial Off The Shelf
CPGA - Ceramic Pin Grid Array
CPU - Central Processing Unit
COA - Cover Our Ass
CQFP - Ceramic Quad Flat Pack
CQJFP - Ceramic Quad J-Leaded Flat Pack
CS - Chip Scale
CSB - Ceramic Side Brazed
CSIA - China Semiconductor Industry Association
CSOJ - Ceramic Small Outline J-Bend Package
CSOLLCC - Ceramic Small Outline Lead Less Chip Carrier
CSOP - Ceramic Small Outline Package
CSP - Chip Scale Package
CSV - Comma Separated Values
CTE - Coefficient of Thermal Expansion
CYA - Cover Your Ass

- D -

d - density
d - diameter
deg - degrees (�)
D - diode
DARPA - The Defense Advanced Research Projects Agency
DC - Direct Current
DCA - Direct Chip Attach
DCAR - Design Concept Activities Review
DESC - Defense Electronic Supply Center
DFE - Design For Excellence
DFM - Design For Manufacturing
DfMA - Design for Manufacturing and Assembly
DFN - Dual Fine Pitch No Leads
DFN+ - Enhanced Dual Fine Pitch No Leads
DIL - Dual In line
DIMM - Dual In-line Memory Module
DIP - Dual In-line Package
DLP - Digital Light Processing
DNS - Domain Name System
DO - Diode Outline
DO - Discrete Outline
DOD - Department Of Defense
DRAM - Dynamic Random Access Memory
DRIE - Deep Reactive Ion Etching
DSCC - Defense Supply Center Columbus
DSL - Design Service Life
DSP - Digital Signal Processor
DSS - Detail Specification Sheet
DTC - Design To Cost
DUNS - Data Universal Numbering System
DXF - Data Exchange File

- E -

e - emissivity
E - voltage
EBCDIC - Extended Binary-Coded Decimal Interchange Code
E3 - Electromagnetic Environmental Effects
EC - Enhanced Cooling
ECA - Electrically Conductive Adhesive, Electronic Components and Assemblies, Equipment and Supplies Association
ECAD - Electronics Computer Aided Design
EDA - Electronics Design Automation
EEE - Electrical and Electronic Equipment
EFT - Electronic Funds Transfer
EIA - Electronics Industry Association
EICTA - European Information Communications Technology Association
EMI - Electromagnetic Interference
EMS - Electronics Manufacturing Services
EOL - End of Life
EOP - End Of Page
EPS - Earnings Per Share
EPL - Electronic Parts List
ERP - Enterprise Resource Planning
ESA - European Space Agency
ESCIES - European Space Components Information Exchange System
ESS - Environmental Stress Screening
EU - European Union
EULA - End User License Agreement

- F -

F - Radiation View Factor
ft - feet (unit of length)
FC - Flip Chip
FC-PGA - Flip Chip Pin Grid Array
FCBGA - Flip Chip Ball Grid Array (0.18 micron technology)
FCIP - Flip Chip In Package
FCOB - Flip Chip On Board
FCOF - Flip Chip On Flex
FCOL - Flip Chip On Lead
FCOL - Flip Chip On Leadframe (package)
FCP - Few-Chip Package
FDA - Finite Difference Analysis
FDM - Finite Difference Model
FE - Finite Element
FEA - Finite Element Analysis
FEM - Finite Element Model
FFAC - Forced Flow Air Cooling
FMEA - Failure Mode and Effects Analysis
FMEAC - Failure Mode, Effects and Criticality Analysis
FP - Flatpack
FPD - Flat Panel Display
FPGA - Field Programmable Gate Array
FPM - Feet Per Minute (Velocity)
FPS - Feet Per Second (Velocity)
FPS - Feet Pound Second (SI Units)
FT - Feet (unit of length)
FTP - File Transport Protocol
FYI - For Your Information

- G -

gnd - Ground
G - Glass
GoT - Glossary of Terms
Gr - Grashoff Number
GHz - Gigahertz
GIGO - Garbage-In Garbage-Out
GLV - Grating Light Valve
GND - Ground
GQFP - Glass Quad Flat Pack
GUI - Graphical User Interface

- H -

h - convection heat transfer film coefficient
h-a - hot spot to ambient
h-b - hot spot to board
h-c - hot spot to case
h-l - hot spot to lead
h-s - hot spot to sink
H - height
H - Thermally Enhanced electronics package designation
Hz - Frequency: Hertz, cycles per second
HALT - Highly Accelerated Life Test
HARM - High Aspect Ratio MEMS
HAST - Highly Accelerated Stress Test
HBGA - plastic thermal enhanced ball grid array package
HCF - High Cycle Fatigue
HDL - Hardware Description Language
HLBGA - plastic thermal enhanced low profile ball grid array package
HLLGA - plastic thermal enhanced low profile land grid array package
HQSOP - Hermetic Quarter Size Outline Package (ceramic or glass package)
HS - Heat Sink
HTML - Hyper Text Mark-up Language
HTOL - High Temperature Operating Life
HTS - High Temperature Storage
HTSSOP - Thermally Enhanced Thin Shrink Small Outline Package
HTTP - HyperText Transport Protocol
HTTPS - Secured HyperText Transport Protocol
HVIC - High Voltage Integrated Circuit

- I -

in - inch (unit of length)
I - current
I/O - Input/Output
ID - Identification
IEC - International Electrotechnical Commission
IETF - Internet Engineering Task Force
IF - Input Factor
IGES - Initial Graphics Exchange Standard
IP - Intellectual Property
IPC - Interconnecting and Packaging Electronic Circuits www.IPC.org
IPC - Integrated Passive Components
IPD - Interdisciplinary Product Development
IPDT - Interdisciplinary Product Development Team
ISO - International Standards Organization

- J -

j-a - junction to ambient
j-b - junction to board
j-c - junction to case
j-l - junction to lead
j-s - junction to sink
JEDEC - Joint Electronic Device Engineering Council (Solid State Technology Association)
JEITA - Japan Electronics and Information Technology Industries Association (JEITA)
JIT - Just In Time

- K -

km - Kilometer
kHz - Kilohertz
K - Thermal Conductivity
K - Absolute Temperature in units of Kelvin
KBE - Knowledge Based Engineering
KFT - Height: thousands of feet
KISS - Keep It Simple Stupid

- L -

lb - pound
L - Low Profile
L - length
LBGA - Low Profile Ball Grid Array
LCC - Leaded Chip Carrier
LCF - Low Cycle Fatigue
LCP - Liquid Crystal Polymer
Lead Protrusion - The distance a through hole component's leads extend out of the backside of a circuit board
LED - Light Emitting Diode
LFBGA - Low-profile, Fine-pitch Ball Grid Array
LFM - Velocity: Linear Feet per Minute
LLCC - Leadless Chip Carrier
LLP - Leadless Leadframe Package
LPCC - Leadless Plastic Chip Carrier (aka: MLP, QFN, & MLF)
LQFP - Low Profile Quad Flat Pack
LRU - Line Replaceable Unit
LSI - Large Scale Integration
LSM - Leaded Surface Mount
LTA - Long Term Agreement
LTS - Low Temperature Storage
LTOL - Low Temperature Operating Life

- M -

m - mass
m - meter (unit of length)
mils - Thousandths of an inch (unit of length)
mm - millimeter (unit of length)
mA - Milliampere
mH - Millihenry
�BGA - Micro Ball Grid Array
�LFP - Micro Lead Frame Package
�LF - Micro Leadframe (aka: LPCC, QFN, & MLP)
�LP - Micro Leadframe Package (aka: LPCC, QFN, & MLF)
�P - Microprocessor
M - mass
M - Metal
M - Meter (unit of length)
M3S - Modular Monolithic MEMS
MAP - Manifold Absolute Pressure
MCDI - Miner's Cumulative Damage Index
MCM - MultiChip Module
MCP - Multichip Package
Mdot - Mass flow rate
MDI - Miner's Damage Index
MDIP - Metal DIP
MEM - Microelectromechanical
MEMS - Micro-Electro-Mechanical-Systems
MHz - Megahertz
MIME - Multipurpose Internet Mail Extensions
MKS - Meter Kilogram Second
MLC - Multilayer Capacitor
MLC - Multilayer Chip
MLCC - Multi-Layer Ceramic Capacitor
MLP - Micro Leadframe Package
MO - Mechanical Outline
MMIC - Monolithic Microwave Integrated Circuit
MO - Microelectronic Outline
MoC - Materials of Concern
MoU - Memorandum of Understanding
MOEMS - Micro-Optical-Electro-Mechanical Systems
MPM - Meters Per Minute (Velocity)
MPS - Meters Per Second (Velocity)
MQFP - Metal Quad Flat Pack
MQFP - Metric Quad Flat Pack
MRAM - Magnetic Random Access Memory
MRP - Material Requirements Planning
MS - Microcircuit Standard
MS - Microelectronic Standard
MSDS - Material Safety Data Sheets
MSL - Mean Sea Level
MST - Micro-System-Technology
MTBF - Mean Time Between Failures
MTBMAF - Mean Time Between Mission Affecting Failures
MTBR - Mean Time Between Removal
MTBUMA - Mean Time Between Unscheduled Maintenance Actions
MUMPS - Multi-User MEMS Process

- N -

no. - number
N - Newton
Nu - Nusselt Number
N/A - not available
NAS - National Aerospace Standard
NASA - National Aeronautics and Space Administration
NATO - North Atlantic Treaty Organization
NAVSEA - Naval Sea Systems Command
NPD - New Product Development
NCAGE - NATO Commercial and Government Entity
NRE - Non-Recurring Engineering

- O -

op - operating
OEM - Original Equipment Manufacturer
OTS - Off The Shelf

- P -

p - pico
p - pressure
ppm - parts per million
psia - pounds force per square inch absolute scale
psig - pounds force per square inch gauge scale
P - Plastic or epoxy package material
P - Electrical Power (Watts)
PoF - Physics of Failure
Pr - Prandtl Number
PCA - Printed Circuit Assembly
PCB - Printed Circuit Board
PCGA - Plastic Column Grid Array
PCN - Product Change Notification (see JESD46)
PD - Product Development
PDF - Portable Document Format (Adobe)
PDIP - Plastic DIP
PDR - Preliminary Design Review
PEM - Plastic Encapsulated Microcircuit
PDM - Product Data Management
PDT - Product Development Team
PEM - Plastic Encapsulated Microcircuit
PFA - Plucked From Air
PFM - Plastic Flange Mount
PFP - Plastic Flat Pack
PGA - Pin Grid Array
PGA - Programmable Gate Array
PL - Parts List
PLCC - Plastic Leaded Chip Carrier
PLD - Programmable Logic Device
PLG - Parts List Generator
PLLCC - Plastic Leadless Chip Carrier
PLM - Product Lifecycle Management
PN - Part Number
PPGA - Plastic Pin Grid Array
PPL - Preferred Parts List
PQFP - Plastic Quad Flat Pack
PS - Power Supply
PSI - Pressure: Pounds per Square Inch
PSL - Preferred Supplier List
PSOIC - Plastic Small Outline Integrated Circuit
PSOJ - Plastic Small Outline J Bend
PSTC - Pressure-Sensitive Tape Council
PWA - Printed Wiring Assembly
PWB - Printed Wiring Board
PZIP - Plastic Zig Zag Inline Package

- Q -

q - dissipated heat
Q - volumetric flow rate
Qty - Quantity
Q Factor - Quality factor
QED - Quod Erat Demonstrandum (click here for more detail)
QFN - Quad Flat No Lead Package
QFP - Quad Flat Pack
QPL - Qualified Products List , Qualified Parts List
QSOP - Quarter Size Outline Package
QUIP - Quad Inline Package
QVSOP - Quad Very Small Outline Package

- R -

r - radius
R - Absolute Temperature in units of Rankine
R - Resistance (thermal or electrical)
Re - Reynolds Number
Ref Des - Reference Designation
RoHS - Restriction of Hazardous Substances
RoT - Rules of Thumb
R&D - Research & Development
RAM - Random Access Memory
RBE - Rules Based Engineering
RF - Radio Frequency
RFI - Request For Information
RFP - Request For Proposals
RFQ - Request For Quote
RMS - Root Mean Square
ROA - Return On Assets
ROI - Return On Investment = Profit $/ Investment $
ROM - Read Only Memory
ROM - Rough Order of Magnitude
ROR - Recommended Operating Range
ROR - Return On Revenues
RPM - Revolutions per minute
RTCA - Radio Technical Commission for Aeronautics
RTD - Resistance Temperature Detector
RTM - Read The Manual
RTV - Room Temperature Vulcanization

- S -

stg - storage
SiP - System in package
SoC - System on Chip
SoP - System on Package
S/MIME - Secure Multipurpose Internet Mail Extensions
SAC - Lead-free solder composed of SnAgCu (Tin, Silver, and Copper)
SB - Side Brazed
SCD - Source Control Drawing
SCD - Specification Control Drawing
SCM - Supply Chain Management
SI - International System of Units
SIMM - Single In-line Memory Module
SIP - Single In-line Package
SM - Surface Mount
SMA - Surface Mount Adhesive
SMC - Surface Mount Component
SMD - Surface Mount Device
SMT - Surface Mount Technology
SO - Small Outline
SOAP - Simple Object Access Protocol
SOD - Small Outline Device
SOD - Small Outline DIP
SOE - Small Outline EIAJ
SOIC - Small Outline Integrated Circuit
SOJ - Small Outline J-Bend Package
SOP - Small Outline Package
SOP - Standard Operating Procedure
SOT - Small Outline Transistor
SPC - Statistical Process Control
SPDIP - Shrink Spastic Dual Inline Package
SPICE - Simulation Program for Integrated Circuits Emphasis
SQL - Structured Query Language
SRAM - Static Random Access Memory
SS - Steady State
SSFDC - Solid State Floppy Disk Card
SSOP - Shrink Small Outline Package
STD - Standard
SWAG - Scientific Wild Ass Guess

- T -

t - relative temperature in units of degrees Celsius, degrees centigrade, or degrees Farenheit
t - time
T - Thin
T - Transistor
T - Absolute Temperature Kelvin or Rankine
T/C - Thermocouple
TB - Top Brazed
TBD - To Be Determined
TBGA - Tape Ball Grid Array
TBR - To Be Reviewed
TC - Temperature Cycle
TC - Thermocouple
TEC - Thermoelectric Cooler
TFBGA - plastic Thin Fine-pitch Ball Grid Array package
TFXBGA - Thin, Fine Pitch Ball Grid Array
TH - Through Hole
THB - Temperature Humidity Bias
THC - Through Hole Component
THD - Through Hole Device
THT - Through Hole Technology
TIA - Telecommunications Industry Association
TIFF - Tagged Image File Format
TIM - Technical Interchange Meeting
TIM - Thermal Interface Material
TO - Transistor Outline
TQFP - Thin Quad Flat Pack
TS - Thermal Shock
TS - Transistor Standard
TSOP - Thin Small Outline Package
TSSOP - Thin Shrink Small Outline Package
TVSOP - Thin Very Small Outline Package

- U -

UDDI - Universal Description, Discovery, and Integration
UI - User Interface
UPrating - A process to assess the capability of an electronic component to meet functional and performance requirements in an application outside of the manufacturer's specified temperature range.
UO - Uncased Outline
URL - Uniform Resource Locator
US - Uncased Standard
UTSOP - Ultra Thin Small Outline Package
UWB - Ultra-Wideband

- V -

v - very
V - Velocity
V - Voltage
V/m - Volts per meter
Vel - Velocity
Vetronics - Vehicular Electronics
Vol - Volume
VDC - Volts Direct Current
VFBGA - plastic Very thin Fine-pitch Ball Grid Array package
VID - Vendor Item Drawing
VOCs - Volatile Organic Compounds
VLSI - Very Large Scale Integration
VME - VERSA Module Eurocard
VRM - Voltage Regulator Module

- W -

w/ - with
w/o - without
wrt - with respect to
W - Width
W - Electrical Power (Watts)
W3C - World Wide Web Consortium
WBBGA - Wirebond Ball Grid Array
WEEE - Waste Electrical and Electronic Equipment
WLCSP - Wafer-Level Chip Scale Package
WLP - Wafer-Level Packaging
WSTS - World Semiconductor Trade Society
WWW - World Wide Web (or sometimes called the World Wide Wait)
WYSIWYG - What You See Is What You Get

- X -

XAML - eXtensible Application Markup Language
XML - eXtensible Markup Language

- Y -

Y - psi = thermal characterization parameter = temperature rise divided by the total power dissipation

- Z -

ZIF - Zero-Insertion Force
ZIP - Zig Zag Inline Package

- Symbols -

e - emissivity
D - delta (difference between two values)
� - ambient
� - infinity
l - lambda
r - density
� - absolute viscosity
� - micro
C_p - specific heat at constant pressure
C_v - specific heat at constant volume
q_C-� or R_C-� - Thermal Resistance from Case to Ambient
q_C-R or R_C-R - Thermal Resistance from Case to Radiation
q_C-S or R_C-S - Thermal Resistance from Case to Conduction Sink
q_J-C or R_J-C - Thermal Resistance from Junction to Case
�C - degrees Centigrade or Celsius
�F - degrees Fahrenheit
K - Absolute Temperature in units of Kelvin
R - Absolute Temperature in units of Rankine
T_a - ambient temperature
T_� - local ambient air
T_C - average case temperature
T_J - junction (or hot spot) temperature
T_R - radiation boundary temperature
T_S - conduction boundary temperature

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